Junior MFG Engineer

Job Description

  Device Engineering
  IYM (Integrated Yield Management)
- Process integration for mass production (FAB & Sort)
- Set KPI goal related to Yield performance (Yield, D0, YLD saving$,...)
- FA and problem solving in FAB & Unit probe
- Technology/process/product Transfers
 
Interface between BE / PL and FAB
- Primary contact window for site communication (FAB – Ass’y – BU – QA)
- New product and new process introduction to manufacturing (NPD & MRR)
- Support B/E open yield/quality issues & projects
- Process Change Management(PCP)   

Process Engineering
  - Make a powerful & competitive process. (Productivity/Quality/Cost/Technology)
- Problem solving techniques to resolve operational issues with unit processes
- Support a development of new technology & develop new unit process with
  creative thinking.
- Familiar with a broad range of semiconductor fabrications and clean room
  technologies.
- Improve process quality of Cp & Cpk.
- Make a cost reduction.
- Reduce wafer cycle time and wafer scrap

Qualifications
Device Engineering
- Perform Electrical Characterization
- Understand the physical layout of the part and perform topo verification
- Use schematic/layout to correlate failures when necessary
- Understand various FA techniques available for de-processing failures
- Proficient in fab and probe data extractions for data analysis
- Correlate frontend yield metrics to probe/parameter
- Provide qualification results to internal and external customers
- Provide qualification data for published device parametric specifications

Process Engineering
- Above a bachelor (graduated from chemistry, material science, electronics & Electrical Engineering University or related scholarship degree)
- Need problem solving and troubleshooting skills
- Need reasonable thinking and analytical skills
- Need oral and written communication skills in English
- Basic statistics and DOE understanding
- Strong fellowship, initiative and progressive mind